X-ray inspection systems and applications

  • Roland Kovács
  • Published 2004 in
    27th International Spring Seminar on Electronics…

Abstract

Nowadays, X-ray applications are more and more important for electrical technologies. The ICs are smaller and more complex than before. Area array packages (ball grid array, chip scale package, quad flat pack, and flip chip) are widely used. These devices cover their joints and optical testers are unsuitable for checking them. Only X-ray inspection systems… (More)

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