X-ray computed tomography on miniaturized solder joints for nano packaging

Abstract

The challenge of nano packaging requires new nondestructive evaluation (NDE) techniques to detect and characterize very small defects like transportation phenomenon, Kirkendall voids or micro cracks. Imaging technologies with resolutions in the sub-micron range are the desire. But what does nano packaging mean? High end semiconductor industries today deal… (More)

18 Figures and Tables

Topics

  • Presentations referencing similar topics