X-ray computed tomography on miniaturized solder joints for nano packaging


The challenge of nano packaging requires new nondestructive evaluation (NDE) techniques to detect and characterize very small defects like transportation phenomenon, Kirkendall voids or micro cracks. Imaging technologies with resolutions in the sub-micron range are the desire. But what does nano packaging mean? High end semiconductor industries today deal… (More)

18 Figures and Tables


  • Presentations referencing similar topics