Worst-Case Temperature Analysis for Different Resource Availabilities: A Case Study

  title={Worst-Case Temperature Analysis for Different Resource Availabilities: A Case Study},
  author={Lars Schor and Hoeseok Yang and Iuliana Bacivarov and Lothar Thiele},
With three-dimensional chip integration, the heat dissipation per unit area increases rapidly and may result in high on-chip temperatures. Real-time constraints cannot be guaranteed anymore as exceeding a certain threshold temperature can immediately reduce the systems reliability and performance. Dynamic thermal management methods are promising methods to prevent the system from overheating. However, when designing modern real-time systems that make use of such thermal management techniques… CONTINUE READING


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