Within-die process variations: How accurately can they be statistically modeled?

  title={Within-die process variations: How accurately can they be statistically modeled?},
  author={Brendan Hargreaves and Henrik Hult and Sherief Reda},
  journal={2008 Asia and South Pacific Design Automation Conference},
Within-die process variations arise during integrated circuit (IC) fabrication in the sub-100nm regime. These variations are of paramount concern as they deviate the performance of ICs from their designers' original intent. These deviations reduce the parametric yield and revenues from integrated circuit fabrication. In this paper we provide a complete treatment to the subject of within-die variations. We propose a scan-chain based system, vMeter, to extract within-die variations in an… 

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