Wireless interconnect for board and chip level

  title={Wireless interconnect for board and chip level},
  author={Gerhard Fettweis and Najeeb ul Hassan and Lukas Landau and Erik Fischer},
  journal={2013 Design, Automation & Test in Europe Conference & Exhibition (DATE)},
Electronic systems of the future require a very high bandwidth communications infrastructure within the system. This way the massive amount of compute power which will be available can be inter-connected to realize future powerful advanced electronic systems. Today, electronic inter-connects between 3D chipstacks, as well as intra-connects within 3D chipstacks are approaching data rates of 100 Gbit/s soon. Hence, the question to be answered is how to efficiently design the communications… CONTINUE READING
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