Wirelength driven I/O buffer placement for flip-chip with timing-constrained

Abstract

Flip-chip package provides the highest chip density because I/O buffers in it could be placed anywhere inside a chip. The assignment of bump pads, I/O buffers and I/O pins will affect the satisfaction of timing requirement inside die core. In this paper, we proposed an effective three-step hierarchical approach to satisfy the timing-constrained I/O buffer… (More)
DOI: 10.1109/APCCAS.2012.6419114

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