Wire bonding on glass substrates via vapour deposition of Ag-Ti film

  title={Wire bonding on glass substrates via vapour deposition of Ag-Ti film},
  author={Nicholas Kam and Michael David Hook and Tanya Tang and Michael Mayer},
  journal={Microelectron. J.},
1 Citations


Flip chip electrical interconnection by selective electroplating and bonding
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  • P. Benjamin, C. Weaver
  • Materials Science
    Proceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences
  • 1962
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