Wire bonding on glass substrates via vapour deposition of Ag-Ti film

@article{Kam2019WireBO,
  title={Wire bonding on glass substrates via vapour deposition of Ag-Ti film},
  author={Nicholas Kam and Michael David Hook and Tanya Tang and Michael Mayer},
  journal={Microelectron. J.},
  year={2019},
  volume={90},
  pages={199-203}
}
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