Wafer-scale microdevice transfer/interconnect: its application in an AFM-based data-storage system

  title={Wafer-scale microdevice transfer/interconnect: its application in an AFM-based data-storage system},
  author={Michel Despont and Ute Drechsler and Rong-huan Yu and H. Bernhard Pogge and Peter Vettiger},
  journal={Journal of Microelectromechanical Systems},
We have developed a robust, CMOS back end of the line (BEOL) compatible, wafer-scale device transfer, and interconnect method for batch fabricating systems on chip that are especially suitable for MEMS or VLSI-MEMS applications. We have applied this method to transfer arrays of 4096 free-standing cantilevers with good cantilever flatness control and high-density vertical electrical interconnects to the receiver wafer (typically CMOS). Such an array is used in a highly parallel, scanning-probe… CONTINUE READING
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