Wafer-level technology for sub-mm wave focal plane arrays


A robust and compact scheme for building Submm-wave array receivers will be presented in this paper. By utilizing wafer-level integration the scheme enables compact multi-pixel modules. Bulk Silicon Deep Reactive Ion Etching techniques are used to build waveguides that allow the RF signals to be routed in the third dimension. Finally, a novel micro-lens… (More)


3 Figures and Tables

Slides referencing similar topics