Wafer level packaging having bump-on-polymer structure

@article{Reche2003WaferLP,
  title={Wafer level packaging having bump-on-polymer structure},
  author={John J. H. Reche and Deok-Hoon Kim},
  journal={Microelectronics Reliability},
  year={2003},
  volume={43},
  pages={879-894}
}
Kulicke & Soffa s Flip Chip Division (formerly Flip Chip Technologies), the market leader of wafer level packaging (WLP) technology, has developed a new WLP technology-the Spheron WLPe. Spheron WLPe was developed with bump-on-polymer structure to decrease the input capacitance for high-speed applications. During development of the Spheron WLPe technology, a new polymer dielectric material was carefully selected from seven (7) materials that were tested in terms of reliability and… CONTINUE READING
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