Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab

@article{Tilmans2001WaferlevelPR,
  title={Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab},
  author={H. A. C. Tilmans and Hocine Ziad and Henri Jansen and O. Di Monaco and Alexis Jourdain and Walter de Raedt and Xavier Rottenberg and Eddy De Backer and A. Decaussernaeker and K. Baert},
  journal={International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224)},
  year={2001},
  pages={41.4.1-41.4.4}
}
Reports on wafer-level packaged RF-MEMS switches fabricated in a commercial CMOS fab. Switch fabrication is based on a metal surface micromachining process. A novel wafer-level packaging scheme is developed, whereby the switches are housed in on-chip sealed cavities using benzocyclobutene (BCB) as the bonding and sealing material. Measurements show that the influence of the wafer-level package on the RF performance can be made very small. 
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