Wafer bonding technique based GaN/Quantum Dots/GaN system


Integration of colloidal semiconductor quantum dots with epitaxial semiconductor materials offers the possibility of a wide variety of new device structures. In this work, wafer bonding processes for layered GaN/Quantum Dots/GaN structures are described. Bonding is achieved by thermal reorganization of bidentate ligand thiophenethiol which initially caps… (More)


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