Wafer Level Thin Film Encapsulation for BAW RF MEMS

  title={Wafer Level Thin Film Encapsulation for BAW RF MEMS},
  author={J. L. Pornin and Charlotte Gillot and Guy Parat and Fabrice Jacquet and Emmanuelle Lagoutte and Nicolas Sillon and Gilles Poupon and Fabien Dumont},
  journal={2007 Proceedings 57th Electronic Components and Technology Conference},
The BAW (Bulk acoustic Wave) RF filters that are used in mobile phone application are composed of pair of piezo electrical resonators which need an air gap above them to operate. This air gap consists of a cavity defined by a dielectric layer which is above each resonator. The size of this cavity is smaller than 200 mum square and less than 5 mum high. The process that has been developed to produce this uses conventional I.C. manufacturing technologies at wafer level with only three… CONTINUE READING


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Micropackaging Technologies for Integrated Microsystems: Applications to MEMS and MOEMS

  • K. Najafi
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