Wafer Level Electromigration Tests for Production Monitoring

@article{Root1985WaferLE,
  title={Wafer Level Electromigration Tests for Production Monitoring},
  author={Bryan J. Root and Tim E. Turner},
  journal={23rd International Reliability Physics Symposium},
  year={1985},
  pages={100-107}
}
Smaller geometrics are requiring metal lines to carry higher current densities. This increases their susceptibility to electromigration. This paper describes the SWEAT test (Standard Wafer-level Electromigration Acceleration Test) which was developed to monitor electromigration susceptibility at the wafer level. The test is extremely fast, allowing evaluation of a metal line in less than 15 seconds. It also uses a specially designed test structure to concentrate those stresses which lead to… CONTINUE READING

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