Visual inspection system for the classification of solder joints

@article{Kim1999VisualIS,
  title={Visual inspection system for the classification of solder joints},
  author={Tae-Hyeon Kim and Tai-Hoon Cho and Young Shik Moon and Sung-Han Park},
  journal={Pattern Recognition},
  year={1999},
  volume={32},
  pages={565-575}
}
In this paper, efficient techniques for solder joint inspection have been described. Using three layers of ring-shaped LEDs with different illumination angles, three frames of images are sequentially obtained. From these images the regions of interest (soldered regions) are segmented, and their characteristic features including the average gray level and the percentage of highlights—referred to as 2D features — are extracted. Based on the backpropagation algorithm of neural networks, each… CONTINUE READING
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