Viscoelastic Effect of FR-4 Material on Packaging Stress Development

  title={Viscoelastic Effect of FR-4 Material on Packaging Stress Development},
  author={Y. K. Kim},
  journal={IEEE Transactions on Advanced Packaging},
In the microelectronics device, FR-4 material is one of the key component materials in the packaging structure. The structure of FR-4 is featured as a typical orthotropic polymer composite material reinforced with glass fiber. Although the material may exhibit viscoelastic behavior, the material is commonly regarded as temperature-dependent elastic one in the microelectronics reliability analysis. The purpose of this study is to investigate the material property modeling effect of FR-4 on the… CONTINUE READING


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