Vibration test as a new method for studying the mechanical reliability of solder interconnections under shock loading conditions

@inproceedings{Marjamki2007VibrationTA,
  title={Vibration test as a new method for studying the mechanical reliability of solder interconnections under shock loading conditions},
  author={Pekka Marjam{\"a}ki},
  year={2007}
}
This thesis presents a new large-amplitude vibration test method for studying the reliability of electronic assemblies under mechanical shock loadings. The vibration test has two important advantages as compared to the widely employed JESD22B111 drop test: rstly, the vibration test is a more versatile method and, secondly, the testing can be carried out very rapidly, in the matter of seconds. The impact forces caused by dropping of portable devices make their component boards to vibrate… CONTINUE READING

Citations

Publications citing this paper.
SHOWING 1-9 OF 9 CITATIONS

Toward comprehensive reliability testing of electronic component boards

  • 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)
  • 2010
VIEW 6 EXCERPTS
CITES BACKGROUND
HIGHLY INFLUENCED

Replacement of the drop test with the vibration test — The effect of test temperature on reliability

  • 2008 58th Electronic Components and Technology Conference
  • 2008
VIEW 4 EXCERPTS
CITES BACKGROUND & METHODS
HIGHLY INFLUENCED

On the effects of temperature on the drop reliability of electronic component boards

  • Microelectronics Reliability
  • 2012
VIEW 4 EXCERPTS
CITES BACKGROUND & METHODS
HIGHLY INFLUENCED

Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems

Farbod Askari Farahani, Moustafa Al-Bassyiouni, Abhigit Dasgupta, Sheldon Tolchinsky
  • 2008
VIEW 3 EXCERPTS
CITES METHODS & BACKGROUND
HIGHLY INFLUENCED

References

Publications referenced by this paper.