Vibration fatigue of /spl mu/BGA solder joint

@article{Tu2000VibrationFO,
  title={Vibration fatigue of /spl mu/BGA solder joint},
  author={P. L. Tu and Y. C. Chan and C. W. Tang and Joseph K. L. Lai},
  journal={2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)},
  year={2000},
  pages={1369-1375}
}
  • P. Tu, Y. Chan, +1 author J. Lai
  • Published 2000
  • Materials Science
  • 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)
This paper studies the vibration fatigue failure of /spl mu/BGA solder-joints reflowed with different temperature profiles, and ageing at 120/spl deg/C for 1, 4, 9, 16, 25, 36 days. The effect of the thickness of the Ni/sub 3/Sn/sub 4/ and Cu-Sn intermetallic compound (IMC) on the fatigue lifetime is also reported. During the vibration fatigue test, in order to identify the failure of /spl mu/BGA solder joint, electrical interruption was monitored continuously through the daisy-chain network… Expand
Aging studies of PBGA solder joints reflowed at different conveyor speeds
  • S. Fan, Y. Chan, C. W. Tang, J. Lai
  • Materials Science
  • 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)
  • 2000
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