Vertical Furnaces for Thin Film Deposition and Annealing Contributing to Low-cost, High-performance Semiconductor Device Manufacturing

Abstract

INTRODUCTION A supply chain able to provide cheap high-performance semiconductor devices as required is a major factor in our advanced information society. Large batch vertical furnaces for thin film formation and annealing are widely used in semiconductor device production. Working together, Hitachi, Ltd. and Hitachi Kokusai Electric Inc. led the world in the development and commercialization of these vertical furnaces for use in mass production. Vertical furnaces in current use are typically able to form thin films on more than 100 300-mm φ Si (silicon) wafers at a time with nm-order accuracy and perform annealing with temperature uniformity of ± 0.5°C. This article describes how vertical furnaces were developed from horizontal furnaces to become mainstream, the latest trends in thin film formation and annealing, and the potential for the scope of application of vertical furnaces to extend from semiconductor technology into the field of green innovation technologies.

4 Figures and Tables

Cite this paper

@inproceedings{Kunii2011VerticalFF, title={Vertical Furnaces for Thin Film Deposition and Annealing Contributing to Low-cost, High-performance Semiconductor Device Manufacturing}, author={Yasuo Kunii and Sadao Nakashima and Hironobu Miya and Hidehiro Yanagawa and Nobuyuki Mise}, year={2011} }