Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

@inproceedings{Cheng2001VacuumPT,
  title={Vacuum packaging technology using localized aluminum/silicon-to-glass bonding},
  author={Yu-Ting Cheng and Wen Ting Hsu and Liwei Lin and Clark T.-C. Nguyen and Khalil Najafi},
  year={2001}
}
A vacuum package based on localized aluminum/silicon-to-glass bonding has been successfully demonstrated. With 3.4 watts heating power, /spl sim/0.2 MPa applied contact pressure, and 90 minutes wait time before bonding, vacuum encapsulation at 25 mtorr can be achieved. Folded-beam comb drive /spl mu/-resonators are encapsulated and used as pressure monitors. Long-term testing of un-annealed vacuum-packaged /spl mu/-resonators with a Q of 2500 has demonstrated stable operation after 20 weeks. A… CONTINUE READING

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