Usefulness of VeSTIC devices for low-noise and radiation hard 3D integrated circuits

@article{Staniewski2014UsefulnessOV,
  title={Usefulness of VeSTIC devices for low-noise and radiation hard 3D integrated circuits},
  author={Michal Staniewski and Andrzej Pfitzner},
  journal={2014 Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems (MIXDES)},
  year={2014},
  pages={356-360}
}
VeSTIC technology [1, 2] is a very promising concept of digital, analog and mixed mode ICs design, providing very large scale of integration, extreme layout regularity, as well as the possibility of manufacturing cost reduction and of fully three-dimensional integration. These features seem to be very attractive also in the case of MEMS systems, in particular MAP sensors. With regard to prospective applications, a first insight to noise spectra and radiation hardness of the field-effect VeSTIC… CONTINUE READING