Use it or lose it: Wear-out and lifetime in future chip multiprocessors

@article{Kim2013UseIO,
  title={Use it or lose it: Wear-out and lifetime in future chip multiprocessors},
  author={Hyungjun Kim and Arseniy Vitkovskiy and Paul V. Gratz and Vassos Soteriou},
  journal={2013 46th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)},
  year={2013},
  pages={136-147}
}
Moore's Law scaling is continuing to yield even higher transistor density with each succeeding process generation, leading to today's multi-core Chip Multi-Processors (CMPs) with tens or even hundreds of interconnected cores or tiles. Unfortunately, deep sub-micron CMOS process technology is marred by increasing susceptibility to wearout. Prolonged operational stress gives rise to accelerated wearout and failure, due to several physical failure mechanisms, including Hot Carrier Injection (HCI… CONTINUE READING
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