Corpus ID: 207923709

United States Patent Office 2 , 854 , 388 Patented Sept . 30 , 1958

@inproceedings{Safranek2017UnitedSP,
  title={United States Patent Office 2 , 854 , 388 Patented Sept . 30 , 1958},
  author={William H. Safranek},
  year={2017}
}
  • William H. Safranek
  • Published 2017
  • This invention relates to improvements in electroplat ing. More particularly, it relates to an improved bath and process for electrodepositing copper-tin alloys, where by soluble alloy anodes may be used to maintain the bath in proper concentrations. One of the problems in the prior-art plating of copper tin alloys has been the maintenance of proper concentra tions of components of the bath. As copper and tin are deposited on the cathode, there is a corresponding de pletion of these metals in… CONTINUE READING

    Create an AI-powered research feed to stay up to date with new papers like this posted to ArXiv

    Tables from this paper.