Unified viscoplastic constitutive model for Sn3.8Ag0.7Cu solder

Abstract

The time-independent plastic and time-dependent creep deformations of Sn3.8Ag0.7Cu solder are considered in a unified framework by using a state variable approach. A new viscoplastic constitutive model that includes the kinematic hardening behavior of solder is proposed in this paper. Back stress, which is used for characterizing the kinematic hardening… (More)

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Cite this paper

@article{Yang2010UnifiedVC, title={Unified viscoplastic constitutive model for Sn3.8Ag0.7Cu solder}, author={H.-C. Yang and T.-C. Chiu}, journal={2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference}, year={2010}, pages={1-4} }