Understanding and alleviating intra-die and intra-DIMM parameter variation in the memory system

Abstract

Continued process scaling must overcome several manufacturing challenges. At the same time, industry is exploring many new memory technologies that require new manufacturing processes. In such challenging fabrication regimes, parameter variation (PV) and yield will be important problems. While many recent bodies of work have targeted PV in processors, few… (More)
DOI: 10.1109/ICCD.2016.7753283

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