Underfill of flip-chip: the effect of contact angle and solder bump arrangement

@article{Young2006UnderfillOF,
  title={Underfill of flip-chip: the effect of contact angle and solder bump arrangement},
  author={Wen-Bin Young and Wen-Lin Yang},
  journal={IEEE Transactions on Advanced Packaging},
  year={2006},
  volume={29},
  pages={647-653}
}
An underfill encapsulant was used to fill the gap between the chip and the substrate around the solder joints to improve the long-term reliability of a flip-chip interconnecting system. The underfill encapsulant was filled by the capillary flow. As a part of the series studies of understanding and analysis of the underfill mechanism, this study was devoted to investigate the effects of the contact angle and the bump arrangement on the underfill flow. The Hele-Shaw flow model, that considered… CONTINUE READING

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