Ultrasonic friction power during Al wire wedge-wedge bonding

@article{Shah2009UltrasonicFP,
  title={Ultrasonic friction power during Al wire wedge-wedge bonding},
  author={Aashish Shah and H. Gaul and M. Schneider-Ramelow and H. Reichl and M. Mayer and Y. Zhou},
  journal={Journal of Applied Physics},
  year={2009},
  volume={106},
  pages={013503}
}
Al wire bonding, also called ultrasonic wedge-wedge bonding, is a microwelding process used extensively in the microelectronics industry for interconnections to integrated circuits. The bonding wire used is a 25μm diameter AlSi1 wire. A friction power model is used to derive the ultrasonic friction power during Al wire bonding. Auxiliary measurements include the current delivered to the ultrasonic transducer, the vibration amplitude of the bonding tool tip in free air, and the ultrasonic force… Expand
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