Ultrasonic detection of debond in multi-layer adhesive structure based on wavelet-packet transform

@article{Yi2009UltrasonicDO,
  title={Ultrasonic detection of debond in multi-layer adhesive structure based on wavelet-packet transform},
  author={Dun Yi and Chen Jian-hui and Gao Feng-qi and Xu Zhang-sui},
  journal={2009 4th IEEE Conference on Industrial Electronics and Applications},
  year={2009},
  pages={1145-1148}
}
This paper present a wavelet-packet approach for extracting feature from ultrasonic non-destructive evaluation data of a test multi-layer adhesive structure specimen. These features are then used to obtain an estimate of the specimen's bonded properties. When the multi-layer adhesive structure undergo ultrasonic non-destructive evaluation, echo from… CONTINUE READING