Ultrasonic Effects in the Thermosonic Flip Chip Bonding Process

@article{Wang2013UltrasonicEI,
  title={Ultrasonic Effects in the Thermosonic Flip Chip Bonding Process},
  author={Fuliang Wang and Lei Han},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year={2013},
  volume={3},
  pages={336-341}
}
Thermosonic flip chip (TSFC) bonding is a developing area in array microelectronic interconnection technology, and ultrasonic vibration plays an important role in TSFC bonding. To understand the ultrasonic effects at the bonding interface, a lab bonder is constructed, TSFC bonding is realized, and some ultrasonic effects (plastic deformation of the bumps on… CONTINUE READING