Ultrahigh Strength and High Electrical Conductivity in Copper

  title={Ultrahigh Strength and High Electrical Conductivity in Copper},
  author={Lei Lu and Yongfeng Shen and Xianhua Chen and Lihua Qian and Kun Lu},
  pages={422 - 426}
Methods used to strengthen metals generally also cause a pronounced decrease in electrical conductivity, so that a tradeoff must be made between conductivity and mechanical strength. We synthesized pure copper samples with a high density of nanoscale growth twins. They showed a tensile strength about 10 times higher than that of conventional coarse-grained copper, while retaining an electrical conductivity comparable to that of pure copper. The ultrahigh strength originates from the effective… 
High strength and high electrical conductivity in bulk nanograined Cu embedded with nanoscale twins
A bulk nanograined Cu sample embedded with nanoscale twins is produced by means of dynamic plastic deformation at cryogenic temperatures. It exhibits a tensile yield strength of 610 MPa and an
Ultrahigh strength and high ductility of bulk nanocrystalline copper
We have synthesized artifact-free bulk nanocrystalline copper samples with a narrow grain size distribution (mean grain size of 23nm) that exhibited tensile yield strength about 11 times higher than
A promising structure for fabricating high strength and high electrical conductivity copper alloys
This strategy provides a new route for balancing the strength and electrical conductivity of copper alloys, which can be developed for large-scale industrial application.
Enhanced electrical conductivity and mechanical properties in thermally stable fine-grained copper wire
The rapid development of high-speed rail requires copper contact wire that simultaneously possesses excellent electrical conductivity, thermal stability and mechanical properties. Unfortunately,
Nanostructured Cu-Cr alloy with high strength and electrical conductivity
The influence of nanostructuring by high pressure torsion (HPT) on strength and electrical conductivity in the Cu-Cr alloy has been investigated. Microstructure of HPT samples was studied by
High strength and high electrical conductivity bulk Cu
The achievement of both high strength and high electrical conductivity in bulk materials is challenging in the development of multifunctional materials, because the majority of the strengthening


The effect of grain boundaries on the electrical resistivity of polycrystalline copper and aluminium
Abstract Abstract The contribution to the electrical resistivity caused by grain boundaries has been measured in polycrystalline specimens of high purity copper and various grades of high purity
Nanocrystalline nickel and nickel-copper alloys: Synthesis, characterization, and thermal stability
Pulsed electrodeposition is a simple, yet versatile method for the production of nanostructured metals. For n -nickel we determine the influence of the physical and chemical deposition parameters on
High tensile ductility in a nanostructured metal
A thermomechanical treatment of Cu is described that results in a bimodal grain size distribution, with micrometre-sized grains embedded inside a matrix of nanocrystalline and ultrafine (<300 nm) grains, which impart high strength, as expected from an extrapolation of the Hall–Petch relationship.
Tensile Strength of Whiskers
Tensile tests have been performed on whiskers of iron, copper, and silver 1.2 to 15 μ in diameter. The strongest whiskers which were less than 4 μ in diameter exhibited resolved elastic shear