Ultra-thin and ultra-small 3D double-side glass power modules with advanced inductors and capacitors

Abstract

This paper demonstrates 3D functional modules that are ultra-miniaturized, high-performance and low-cost, based on an innovative 3D Integrated Passive and Active Component (3D IPAC) concept [1]. The 3D IPAC concept utilizes an ultra-thin (30-100 microns) and ultra-low-loss glass substrate, low-cost through-package-vias (TPVs) and double-side redistribution… (More)

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Cite this paper

@article{Gandhi2015UltrathinAU, title={Ultra-thin and ultra-small 3D double-side glass power modules with advanced inductors and capacitors}, author={Saumya Gandhi and Markondeya Raj Pulugurtha and Bruce C. Chou and Parthasarathi Chakraborti and Min Suk Kim and Srikrishna Sitaraman and Himani Goyal Sharma and Venky Sundaram and Rao R. Tummala}, journal={2015 IEEE 65th Electronic Components and Technology Conference (ECTC)}, year={2015}, pages={230-235} }