Ultra Heat-Shock Resistant Die Attachment for Silicon Carbide With Pure Zinc

@article{Suganuma2010UltraHR,
  title={Ultra Heat-Shock Resistant Die Attachment for Silicon Carbide With Pure Zinc},
  author={K. Suganuma and S. H. Kim},
  journal={IEEE Electron Device Letters},
  year={2010},
  volume={31},
  pages={1467-1469}
}
An ultra heat-shock resistant die-attach structure for a silicon carbide power device was developed. A silicon carbide die with a gold/titanium nitride coating was soldered with pure zinc onto a DBC with a silicon nitride insulator plate. This die-attach structure could resist severe thermal shock in air temperatures between -50°C and 300°C. No substantial change in microstructure was observed at the soldering interface, while conventional high-lead solder forms severe cracking. This die-attach… CONTINUE READING