UbBM (under bump metallization) study for Pb-free electroplating bumping : interface reaction and electromigration

@article{Jang2002UbBMB,
  title={UbBM (under bump metallization) study for Pb-free electroplating bumping : interface reaction and electromigration},
  author={Se-Young Jang and J{\"u}rgen Wolf and Woon-Seong Kwon and K. -H. Paik},
  journal={52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)},
  year={2002},
  pages={1213-1220}
}
The effects of reflow time, high temperature aging, and current-stress on interface reactions between Under Bump Metallization (UBM) systems and electroplated bumps have been studied. Each of TiW/Cu/electroplated Cu, Cr/CrCu/Cu, NiV/Cu, and TiW/NiV UBMs was coupled with Pb/63Sn or Sn/3.5Ag flip-chip solder bump. The Sn/3.5Ag and Pb/63Sn flip-chip solder bumps were fabricated on the UBMs using alloy plating. Plated Sn/Ag solder becomes Sn/Ag/Cu by reflowing on the Cu containing UBMs… CONTINUE READING

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