UTCP: A Novel Polyimide-Based Ultra-Thin Chip Packaging Technology

@article{Christiaens2010UTCPAN,
  title={UTCP: A Novel Polyimide-Based Ultra-Thin Chip Packaging Technology},
  author={Wendy Christiaens and Erwin Bosman and Jan Vanfleteren},
  journal={IEEE Transactions on Components and Packaging Technologies},
  year={2010},
  volume={33},
  pages={754-760}
}
Flexible materials, today, are being used already as base substrates for electronic assembly. A lot of mounted components could be integrated in flexible polyimide (PI) substrates. Very interesting advantages of integrating components into the flex are compactness and enhanced flexibility; not only the interconnection but also the components themselves can be mechanically flexible. This paper describes a PI-based embedding technology for integrating very thin silicon chips in between two spin… CONTINUE READING
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