Trends in Emerging On-Chip Interconnect Technologies

Abstract

In deep submicron (DSM) VLSI technologies, it is becoming increasingly harder for a copper based electrical interconnect fabric to satisfy the multiple design requirements of delay, power, bandwidth, and delay uncertainty. This is because electrical interconnects are becoming increasingly susceptible to parasitic resistance and capacitance with shrinking… (More)
DOI: 10.2197/ipsjtsldm.1.2

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