Transmission-line characteristics of on-chip interconnects on multilayer silicon structures with thin-metallic ground substrate

@article{Zhang2006TransmissionlineCO,
  title={Transmission-line characteristics of on-chip interconnects on multilayer silicon structures with thin-metallic ground substrate},
  author={Li-li Zhang and J. M. Song},
  journal={2006 IEEE Antennas and Propagation Society International Symposium},
  year={2006},
  pages={2343-2346}
}
  • Li-li Zhang, J.M. Song
  • Published in
    IEEE Antennas and Propagation…
    2006
  • Materials Science
  • This paper studies the transmission-line characteristics of interconnects in a typical metal-insulator-semiconductor (MIS) structure with a thin metallic ground substrate. The characteristic impedance, extracted resistance, inductance, capacitance, and conductance (RLCG) are simulated. The results demonstrated that the frequency-dependent characteristics of interconnects have changed remarkably with the existence of this ground substrate. Furthermore, this substrate significantly increases the… CONTINUE READING

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