Transient Electrothermal Analysis of Multilevel Interconnects in the Presence of ESD Pulses Using the Nonlinear Time-Domain Finite-Element Method

@article{Shi2009TransientEA,
  title={Transient Electrothermal Analysis of Multilevel Interconnects in the Presence of ESD Pulses Using the Nonlinear Time-Domain Finite-Element Method},
  author={Yan-Bing Shi and Wenyan Yin and Junfa Mao and Peiguo Liu and Qing Huo Liu},
  journal={IEEE Transactions on Electromagnetic Compatibility},
  year={2009},
  volume={51},
  pages={774-783}
}
Comprehensive electrothermal analysis of multilevel interconnects under electrostatic discharge (ESD) stress is carried out using the proposed nonlinear time-domain finite-element method (FEM). The technological, structural, and material parameters used in the analysis correspond to the advanced CMOS process of 90-, 65-, 45, and 32-nm nodes assessed by the International Technology Roadmap for Semiconductors. In order to enhance the computation efficiency and to reduce the memory cost, the… CONTINUE READING
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