Trace crack in molded thin substrate package, root causes and FEM modeling

Abstract

Trace cracks in the substrate of a thin PBGA package were detected after temperature cycle testing during a product qualification. Characteristics of this package include a thin substrate core (0.15 mm) and relatively thin mold cap (0.7 mm). To understand the failure mechanism, the package was submitted for failure analysis (FA). Numerical simulations with… (More)

Cite this paper

@article{Yuan2003TraceCI, title={Trace crack in molded thin substrate package, root causes and FEM modeling}, author={Yuan Yuan and B. J. Carpenter}, journal={Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.}, year={2003}, pages={449-454} }