Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density

@article{Zhao2008TougherUG,
  title={Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density},
  author={Yonghao Zhao and John F. Bingert and Yuntian Zhu and Xiaozhou Liao and Ruslan Z. Valiev and Zenji Horita and Terence G. Langdon and Yizhang Z. Zhou and Enrique J. Lavernia},
  journal={Applied Physics Letters},
  year={2008},
  volume={92},
  pages={081903}
}
Although there are a few isolated examples of excellent strength and ductility in single-phase metals with ultrafine grained (UFG) structures, the precise role of different microstructural features responsible for these results is not fully understood. Here, we demonstrate that a large fraction of high-angle grain boundaries and a low dislocation density may significantly improve the toughness and uniform elongation of UFG Cu by increasing its strain-hardening rate without any concomitant… Expand

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