Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density

@article{Zhao2008TougherUG,
  title={Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density},
  author={Yonghao Zhao and J. Bingert and Yuntian Zhu and Xiaozhou Liao and R. Valiev and Z. Horita and T. G. Langdon and Y. Zhou and E. Lavernia},
  journal={Applied Physics Letters},
  year={2008},
  volume={92},
  pages={081903}
}
  • Yonghao Zhao, J. Bingert, +6 authors E. Lavernia
  • Published 2008
  • Physics
  • Applied Physics Letters
  • Although there are a few isolated examples of excellent strength and ductility in single-phase metals with ultrafine grained (UFG) structures, the precise role of different microstructural features responsible for these results is not fully understood. Here, we demonstrate that a large fraction of high-angle grain boundaries and a low dislocation density may significantly improve the toughness and uniform elongation of UFG Cu by increasing its strain-hardening rate without any concomitant… CONTINUE READING

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