Time Domain Analysis of Multilevel Interconnections Effects in High Performance IC Packages

@article{Razban1989TimeDA,
  title={Time Domain Analysis of Multilevel Interconnections Effects in High Performance IC Packages},
  author={T. Razban and N. El kamoun and J. Chilo},
  journal={1989 19th European Microwave Conference},
  year={1989},
  pages={839-844}
}
Analysis of discontinuities effects due to passive components (interconnecting lines) in modern packages is given. Interconnections used are multilevel designed and burried in multilayered dielectric substrate. Theoretical predictions based on proposed analysis are compared with the experimental results obtained on specific test vehicles. 

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