Through wafer interconnection technologies for advanced electronic devices

@article{Samber2004ThroughWI,
  title={Through wafer interconnection technologies for advanced electronic devices},
  author={Marc De Samber and Ton J.M. Nellissen and E.C.E. van Grunsven},
  journal={Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)},
  year={2004},
  pages={1-6}
}
There is a need for miniaturizing electronic components such as ICs and modules that are used in portable devices like cellular phones and PDAs. Miniaturization not only results in a reduced foot print of the components on the printed board but it can also have a positive effect on the device performance. The ultimate miniaturization is reached when packaging the component into a chip size package (CSP). To enable this, the bonding pads of ICs can be rerouted into, e.g., a ball grid array (BGA… CONTINUE READING

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