Through-thickness thermal conduction in glass fiber polymer–matrix composites and its enhancement by composite modification

  title={Through-thickness thermal conduction in glass fiber polymer–matrix composites and its enhancement by composite modification},
  author={Yoshihiro Takizawa and D. D. L. Chung},
  journal={Journal of Materials Science},
  • Y. Takizawa, D. Chung
  • Published 1 April 2016
  • Engineering, Materials Science
  • Journal of Materials Science
Continuous glass fiber polymer–matrix composites are electrically insulating and used for printed wiring boards, but their thermal conductivity needs to be increased without sacrificing the electrical insulation ability. The through-thickness thermal conductivity of these epoxy–matrix composite laminates with in-plane fibers is found to be effectively modeled using the Rule of Mixtures with fibers and matrix mainly in parallel in the through-thickness direction, in contrast to the series model… 

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Experimental determination of thermal conductivity of printed wiring boards

  • K. AzarJ. Graebner
  • Physics
    Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings
  • 1996
Infrared microscopy has been used to measure the thermal conductivity K of printed wiring boards with embedded layers of Cu, for heat flow perpendicular (K/sub /spl perp//) to the plane of the board.

A poly(vinylidene fluoride) composite with added self-passivated microaluminum and nanoaluminum particles for enhanced thermal conductivity.

A polymer composite was prepared by embedding fillers made of self-passivated aluminum particles in two kind of sizes, micrometer size and nanometer size with different volume proportions into