Three dimensional metallization for vertically integrated circuits

  title={Three dimensional metallization for vertically integrated circuits},
  author={Dieter Bollmann and R. Braun and Reinhold Dipl.-Phys. Buchner and U. Cao-Minh and Manfred Engelhardt and Gerald Errmann and Thomas Dr. Grassl and Konrad Hieber and H. Hubner and G. Kawala and Michael B. Kleiner and Armin Klumpp and Stefan A. Kuhn and Christof Landesberger and Henri J. Lezec and Werner Muth and Werner Pamler and R. M. Popp and E. Renner and G. Ruhl and A. Sanger and Ulrich Scheler and C. Schmidt and Siegfried Schwarzl and Josef Weber and Werner Weber and Peter Ramm},
  journal={European Workshop Materials for Advanced Metallization,},
  • D. Bollmann, R. Braun, P. Ramm
  • Published 1 November 1997
  • Engineering
  • European Workshop Materials for Advanced Metallization,

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