Three-dimensional integration technology using through-si via based on reconfigured wafer-to-wafer bonding

Abstract

Three-dimensional (3-D) integration technologies using through-silicon vias (TSV's) are described. We have developed a 3-D integration technology using TSV's based on a wafer-to-wafer bonding method for the fabrication of new 3-D LSIs. A 3-D image sensor chip, 3-D shared memory chip, 3-D artificial retina chip and 3-D microprocessor test chip have been… (More)
DOI: 10.1109/CICC.2010.5617626

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