Three-dimensional integrated circuits

@article{Topol2006ThreedimensionalIC,
  title={Three-dimensional integrated circuits},
  author={Anna W. Topol and D. L. Tulipe and L. Shi and D. Frank and K. Bernstein and Steven E. Steen and A. Kumar and G. Singco and A. M. Young and K. Guarini and M. Ieong},
  journal={IBM J. Res. Dev.},
  year={2006},
  volume={50},
  pages={491-506}
}
  • Anna W. Topol, D. L. Tulipe, +8 authors M. Ieong
  • Published 2006
  • Engineering, Computer Science
  • IBM J. Res. Dev.
    • Three-dimensional (3D) integrated circuits (ICs), which contain multiple layers of active devices, have the potential to dramatically enhance chip performance, functionality, and device packing density. They also provide for microchip architecture and may facilitate the integration of heterogeneous materials, devices, and signals. However, before these advantages can be realized, key technology challenges of 3D ICs must be addressed. More specifically, the processes required to build circuits… CONTINUE READING
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