Three - dimensional Optical Interconnects for High - density Chip - to - chip and Board -

Abstract

It is generally accepted that the most basic obstacle to continued advances in the speed of computing systems is metal connections. The bottleneck of current metal-based interconnection networks is typically the very limited bandwidth. Optics, due to its inherent parallelism, high bandwidth, freedom from planar constraints, and non-interfering communication… (More)

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Cite this paper

@inproceedings{Sung2007ThreeD, title={Three - dimensional Optical Interconnects for High - density Chip - to - chip and Board -}, author={Hongki Sung}, year={2007} }