Corpus ID: 29105721

This technology allows stacked silicon chips to interconnect through direct contact to provide high-speed signal processing and improved photo detection for image sensing.

@inproceedings{Motoyoshi2009ThisTA,
  title={This technology allows stacked silicon chips to interconnect through direct contact to provide high-speed signal processing and improved photo detection for image sensing.},
  author={Makoto Motoyoshi},
  year={2009}
}
  • Makoto Motoyoshi
  • Published 2009
  • Engineering
  • Recently, the development of three-dimensional large-scale integration (3D-LSI) has been accelerated. Its stage has changed from the research level or limited production level to the investigation level with a view to mass production (1)-(10). The 3D-LSI using through-silicon via (TSV) has the simplest structure and is expected to realize a high-performance, high- functionality, and high-density LSI cube. This paper describes the current and future 3D-LSI technologies with TSV. 

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