Thin and large die assembly pick up process optimization by dynamic modeling

@article{Qian2016ThinAL,
  title={Thin and large die assembly pick up process optimization by dynamic modeling},
  author={Richard J. Qian and Yong Liu},
  journal={2016 17th International Conference on Electronic Packaging Technology (ICEPT)},
  year={2016},
  pages={147-152}
}
This paper studies the traditional thin and large die pick up process by finite element simulation. A complicated transient dynamic model is developed to simulate the die pick up process by ANSYS/LS-DYNA. Multiple 3D contact pairs are set up between collet and die, die and tape, tape and die holder, tape and eject pins in simulation. The modeling of the adhesive de-bonding process is critical to the thin/large die crack. A de-bonding criterion for die surface and tape is studied to show the die… CONTINUE READING