• Materials Science
  • Published 1995

Thick pattern forming method

  title={Thick pattern forming method},
  author={Sakurako Hatori and S Nishimura and 桜子 羽鳥 and 祐行 西村},
PROBLEM TO BE SOLVED: To remove and dispose of the residue of the a paste material attached on a photosensitive resin film surface after a filling process safely and efficiently while restraining influence on a substrate and a pattern at the time of forming a thick film pattern by using a photosensitive resin film for a mask material in the filling process. SOLUTION: A paste material 24 is fastened on a substrate by peeling a photosensitive resin film 22 after removing residue 24a of the paste… CONTINUE READING