Thick-film positive DUV photoresist for implant layer application

@inproceedings{Mori2000ThickfilmPD,
  title={Thick-film positive DUV photoresist for implant layer application},
  author={James Michael Mori and James W. Thackeray and Cheng-Bai Xu and George W. Orsula and E. Barrett Prettyman and Rosemary Bell and Robert Routh},
  booktitle={Advanced Lithography},
  year={2000}
}
A thick positive chemical amplified DUV photoresist, Shipley UV 25, is designed with high transparency (0.18AU) for implant layer application. Comparing with traditional Novolak I-line implant layer resists high aspect ratio and fast photospeed of UV 25 is demonstrated. Lithographic results show that UV 25 has excellent coating capability up to 3 microns thick, with excellent photospeed and good overall lithographic performance for various features. Process optimizations of UV 25 for various… CONTINUE READING

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